Preheating may be useful for thick, multilayer, or copper-rich circuit boards, which draw a lot of heat away from the solder joint. The HAKKO FR-830 heats a localized area of the circuit board from below, thereby facilitating the subsequent desoldering process.
Yes. The FX-973 features a built-in twin-cylinder vacuum pump and comes with the FR-4103 desoldering tool. This allows you to combine soldering and vacuum-assisted THT desoldering at a single workstation.
The FR-400 is particularly useful for printed circuit boards with high thermal capacity, high heat dissipation, or solid THT connections. For typical professional THT desoldering tasks, the 140-watt FR-410 already offers a versatile solution.
That depends primarily on heat requirements and the operating environment. The FR-301 is a portable 110-W solution, while the FR-410 offers 140 W for a wide range of professional applications. For thermally massive circuit boards and large connectors, the FR-400 is a 300-W high-performance desoldering station.
During THT rework, the solder in the metallized through-hole must be completely melted and safely removed. Multilayer printed circuit boards, large connectors, and solid copper areas, in particular, make this difficult due to their high heat dissipation.
HAKKO offers a range of desoldering solutions—from portable units to universal desoldering stations and high-power solutions—tailored to the specific solder joint, PCB design, and thermal requirements.
In THT connections, the solder is located inside the metallized through-hole. To desolder, the terminal and solder joint must therefore be heated sufficiently before the molten solder can be sucked out.
Solid connections and copper-rich circuit boards complicate this process. For this reason, vacuum desoldering tools are generally the best solution for THT rework, while traditional soldering irons are typically used for special cases or rework.
Not every THT solder joint requires the same power. HAKKO therefore offers solutions for a variety of requirements, ranging from mobile service applications to thermally robust, high-performance assemblies.
The HAKKO FR-301 combines heating and suction in a compact desoldering gun. With 110 W of power and a temperature range of 350 to 500 °C, it is suitable for a wide variety of everyday desoldering tasks that require mobility and ease of use.
This makes the FR-301 ideal for applications such as maintenance, repair, or temporary workstations, provided that the thermal requirements of the assembly do not necessitate a stationary, high-performance solution.
For professional stationary workstations, the HAKKO FR-410 is the more versatile solution. It operates at 140 W and has a temperature range of 330 to 450 °C.
HAKKO has designed the station specifically for use with multilayer printed circuit boards, micro-solder eyes, and densely populated assemblies. A valve function with high suction power and the guidance of the extracted solder to the filter ensure a reliable desoldering process.
The FR-410 thus covers a wide range of typical THT rework tasks.
For printed circuit boards with high thermal capacity or particularly massive connectors, significantly more power headroom may be required.
This is where the HAKKO FR-400 comes in. With 300 W of heating power, it was developed for desoldering tasks where strong heat dissipation makes it difficult to completely melt the solder. HAKKO specifically cites high-current circuit boards and assemblies with high heat capacity as its intended applications.
The FR-400 is particularly well-suited for applications in which high thermal capacity, strong heat dissipation, or heavy-duty connections require additional power reserves.
In addition to the station's performance, selecting the right nozzle is crucial. It should be chosen so that both the component lead and the solder pad are adequately contacted and heated at the same time. The diameter and shape must therefore be suited to the lead, the solder pad, and accessibility.
HAKKO offers a variety of N61 nozzles for the FR-410 and N60 nozzles for the FR-400. Choosing the right nozzle supports an efficient desoldering process and can reduce the duration of thermal stress on the circuit board.
Not every workstation is intended to be used exclusively for desoldering. When soldering and THT rework need to be combined flexibly, the HAKKO FX-973 offers an integrated solution.
The 3-port station features a built-in twin-cylinder vacuum pump. The package includes the 140-W FR-4103 desoldering tool, which is compatible with N61-series desoldering nozzles. This allows the FR-410’s technology to be integrated into a multifunctional soldering and desoldering workstation.
This makes the FX-973 particularly appealing when a workstation needs to handle not only THT desoldering but also various other soldering tasks.
For thick, multilayer, or copper-rich printed circuit boards, targeted preheating can facilitate the desoldering process. The compact HAKKO FR-830 is designed for localized preheating and operates in the range of 150 to 300 °C at the air outlet.
As a result, the required temperature rise does not have to be generated exclusively at the desoldering site itself. For assemblies with high thermal mass, this can help reduce local contact times and result in a more controlled desoldering process. Whether preheating is advisable depends on the PCB design, the size of the connections, and the thermal mass.
After desoldering, residual solder may remain on pads or through-holes. The halogen-free, no-clean desoldering braid HAKKO FR-551, available in various widths, is suitable for this purpose.
It complements vacuum desoldering technology for the targeted removal of small amounts of solder, but does not replace it for thermally demanding THT connections.
Therefore, there is no single tool for every THT rework application. The key factors are heat requirements, connector size, PCB design, and the work environment.
The HAKKO solution best suited for THT rework depends on the heat requirement, pin size, PCB design, and work environment. A range of desoldering solutions is available, from the portable FR-301 and FR-410 to the FR-400 and the multifunctional FX-973. The FR-830 and FR-551 can be used to supplement the process for preheating and residual solder removal, respectively.
The key factor, therefore, is not the highest possible power, but rather a solution that is suited to the thermal and geometric characteristics of the THT solder joint.
