Desoldering Stations

In soft soldering, especially in rework applications, new challenges for soldering equipment are constantly emerging that must be solved for a wide range of applications. Small solder pads and micro pads are particularly sensitive due to their size and thermal sensitivity and therefore present a challenge for desoldering tasks. The miniaturization of electronic assemblies results in extremely confined spaces that can no longer be processed using conventional methods. As a result, entire PCBs are often discarded. Another rework area with similar requirements involves miniature assemblies, such as those used in modern mobile phones.
Multilayer PCBs present particular challenges in the opposite direction, as they contain internal and often high-mass layers to achieve high packing density, shielding or heat dissipation. The heat capacity of the desoldering iron is often insufficient for working on such PCBs. This also applies to assemblies used in low-voltage technology. In these cases, high currents require connection cables with larger cross-sections and therefore also higher-mass PCBs. A good example is the control systems supplied to the automotive industry, particularly in the rapidly growing field of electromobility.

As part of a large development program, HAKKO has been addressing these soldering and desoldering challenges for many years. The result is a wide range of suitable tools that enable rework and soldering tasks to be carried out more effectively.

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