HAKKO brings the FX-305 is launching a new generation of solder bath systems onto the market. The new design of the FX-305 is characterized by solder balls of different sizes. The solder bath can be used flexibly for soldering all types of electrical component connections and is therefore also suitable for larger assemblies.
The solder crucibles equipped with improved high-performance heating elements are available in the dimensions (WxHxD) 50 x 42.5 x 50 mm, 75 x 42.5 x 75 and 100 x 53 x 100 mm. This significantly expands the range of applications in terms of the size of the components to be processed. Thanks to the high-performance heating elements, the FX-305 achieves a maximum temperature of 530 degrees in relation to the solder crucible used and therefore offers the widest possible temperature range on the market.
As improved heating elements reduce the heating time by up to 60 %, the system can be used more efficiently and saves energy. „The 4th generation of dip and flat solder baths from Hakko meets all the requirements that the processing of components in electronics production places on soldering with solder baths,“ emphasizes Kirstin Kullik, Managing Director of Technisches Büro Kullik GmbH.
When developing the FX-305, the main focus was also placed on handling and safety when using the system. The cover on the crucible prevents the solder tin from splashing. At the same time, all device parameters and the required process data are shown to the user on the display. The special feature here is that the temperature can still be seen even in stop mode and when the heating elements are switched off, ensuring that the system is always safe to use.
Thanks to data transmission, all process data can be saved, edited and monitored using a PC system. As the solder bath temperature is measured by means of sensor monitoring, the FX-305 meets all traceability requirements. An external temperature measurement and offset transmission to the system via infrared interfaces also ensure error-proofing.