At the EFX Expo 2026 in Stuttgart, our partner EUTECT showcased its Multiple Process Changer with an integrated HAKKO FU 500/FU 601 Auto Soldering System, demonstrating the synergy between flexible robotic automation and precise soldering technology.
The first EFX Expo for Electronics Manufacturing took place in Stuttgart from October 6 to 8, 2026. This new trade show focused on the latest technologies and solutions for modern electronics manufacturing and brought together companies from the manufacturing, automation, and electronics sectors.
Among the solutions on display was the Multiple Process Changer, MPC for short, from EUTECT. The flexible automation platform was showcased at EFX alongside a collaborative robot from Mitsubishi Electric and the HAKKO FU 500/FU 601 Auto Soldering System.
This allowed visitors at the event to see firsthand how precision soldering technology can be integrated into a flexible, automated process environment.
HAKKO soldering technology for automated processes
For the configuration displayed at the EFX Expo, the MPC was equipped with the HAKKO FU 500/FU 601 Auto Soldering System.
The system was developed specifically for automated soldering tasks and combines controlled solder feed with a high-performance soldering unit. The FU 500 and FU 601 perform different tasks within the soldering process.
The FU 500 ensures precise solder wire feeding and supports solder diameters starting at 0.3 mm. This allows the solder feed to be tailored specifically to the application at hand.
The FU 601 is the actual soldering unit and, with a power output of up to 300 watts, provides the thermal power required for demanding automated soldering tasks. The temperature range of 50 to 500 °C, along with six storable temperature settings, allows for flexible adaptation to different process requirements.
When automation and soldering technology work together
Automated soldering requires the precise coordination of various process parameters. The positioning of the tool, the robot's movement, the solder feed, and the soldering temperature must be reliably synchronized.
This is exactly where EUTECT's and HAKKO's technologies complement each other.
The MPC enables flexible control and easy customization of the automated process. The HAKKO FU 500/FU 601 system also provides the soldering technology necessary for controlled and reproducible processing.
The result is a solution that not only enables automated motion sequences but can also reliably control the parameters critical to the soldering process.
For users, this means greater process reliability, reproducible results, and the ability to flexibly adapt automated soldering tasks to different requirements.
On display live at the EFX Expo
With the integration of HAKKO soldering technology into the EUTECT MPC, a concrete application of automated soldering was demonstrated at the EFX Expo 2026.
The solution on display clearly demonstrated how modern robotics, flexible process control, and professional soldering technology can be integrated.
For HAKKO, integrating the FU 500/FU 601 into such automation concepts is a key component of its own approach: Professional soldering technology should not only be suitable for manual applications but also integrate reliably into automated manufacturing processes.