Here you'll find all the frequently asked questions and answers we've compiled for you.
Automated processes operate using defined positions and motion sequences. The soldering tip must therefore make reproducible contact with the solder joint and the terminal. In the case of K-type soldering tips with a groove, the geometry also influences how solder is held in the tip’s working area and applied to the solder joint.
The width should be suited to the geometry and arrangement of the connections, as well as the available installation space. In addition, the contact area, heat requirements, and the amount of solder needed must be taken into account. Therefore, a tip that is as wide or as narrow as possible is not necessarily the better solution.
No. Drag soldering is one possible process method, for example, in terminal strips. Depending on their geometry, K-tips with a groove can also be used for individual solder joints, as demonstrated by applications involving microswitches and ultrasonic sensors.
Solder can be held in the groove within the working area of the soldering tip. Depending on the application, this solder can be applied during a guided motion or at a single solder joint. The width and depth of the groove must be appropriate for the specific soldering task.
Depending on the model, K-series soldering tips with a groove are suitable for applications such as terminal blocks, connectors, microswitches, and sensor connections. The appropriate model depends on the solder joint geometry, heat requirements, the amount of solder needed, and the motion sequence.
Once all solder joints have completely melted, the component can be lifted using the integrated vacuum pipette and a suitable suction cup. This requires a suitable setup for vacuum pickup. When used correctly, this reduces the risk of damaging solder pads or circuit traces by forcibly pulling them off.
Preheating can be particularly useful for larger or thermally massive printed circuit boards. Preheating the assembly can reduce the temperature difference that must subsequently be introduced from above using hot air.
The hot air temperature of the FR-811 can be adjusted from 50 to 600 °C. The air flow rate can be adjusted between 5 and 115 l/min. The actual air flow may vary depending on the nozzle geometry used.
The FR-811 is designed for professional SMD rework tasks. Among other things, it is suitable for assemblies with high component density or higher thermal requirements, as well as for components where multiple solder joints must be heated simultaneously with hot air.
Key factors include the size and geometry of the solder joint, thermal mass, accessibility, and the required contact area. Cycle time and process stability should also be taken into account. The D-shape must transfer sufficient heat without affecting adjacent components or structures.
